Shenmao / Pai Sn/Pb Solder Paste Serie
(click to view the table) |
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Characteristics:
- High Print Speed upto 120 mm/sec
- Reflow with or without notrogen
- Over 8 hrs stencil life.
- Excellent Wettability
- Low Void
- Extended Tack Time >12h
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| We also provide lead free micro solder paste for flip chip process. |
| LEAD- FREE SOLDER PASTE (click to view the table) |
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| Suitable for air nitrogen or Vapour reflow process |
| Characteristics: |
- Pb<1000ppm, Cd<20ppm.
- High Print Speed: 0-120 mm / Sec.
- Over 8 hrs stencil life.
- Excellent Wettability
- Low Void
- Extended Tack Time >12h
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