| SHENMAO / PAI LEAD FREE SOLDER PASTE Sn-Ag-Cu (SAC) Series |
| |
Item\ Product |
SP606-P |
SP607-P |
SP608-P |
SP609-P |
SP610-P |
SP614-P |
Alloy |
Sn/Ag3.0Cu0.5 |
Sn/Ag3.5/Cu0.7 |
Sn/Ag3.9/Cu0.6 |
Sn/Ag3.8/Cu0.7 |
Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01 |
Sn/Ag4.0/Cu0.5 |
Melting Point (C ) |
217-219 |
217-219 |
217-219 |
217-219 |
217-219 |
217-219 |
Particle Size (mm) |
20-45, 20-38 |
20-45, 20-38 |
20-45, 20-38 |
20-45, 20-38 |
20-45, 20-38 |
20-45, 20-38 |
Flux Content (%) |
11±0.5 |
11±0.5 |
11±0.5 |
11±0.5 |
11±0.5 |
11±0.5 |
Flux Type |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
Halide content (%) |
0.05 |
0.05 |
0.05 |
0.05 |
0.05 |
0.05 |
Fluoride |
None |
None |
None |
None |
None |
None |
Viscosity (Pa.S) |
200±30 |
200±30 |
200±30 |
200±30 |
200±30 |
200±30 |
Spread (%) |
80 |
80 |
80 |
80 |
80 |
80 |
Tackiness (gf) |
140 |
140 |
140 |
140 |
140 |
140 |
Corrosion |
Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
S.I.R. |
>1 x 109 |
>1 x 109 |
>1 x 109 |
>1 x 109 |
>1 x 109 |
>1 x 109 |
Electro Migration |
Pass |
Pass |
Pass |
Pass |
Pass |
Pass |
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