SHENMAO / PAI LEAD FREE SOLDER
 

Alloy No.

Alloy Composition

Melting
Pont
( C)

Products
Bar

Gravity

Strength
( Kgf /mm)

Elongation
(%)

Remark

SP 601

Sn-Ag2.5-Cu0.5

2200C

0

7.40

5.30

57

Medium temperature alloy

SP 603+

Sn-Ag3.5

2210C

0

7.36

4.18

58

Soldering rework use

SP 604+

Sn-Cu0.7

2270C

0

7.32

3.80

50

Wave soldering & rework

SP 605

Sn99.95

2320C

0

7.28

2.20

55

Medium temperature alloy

*SP 606+

Sn-Ag3.0-Cu0.5

2190C

0

7.40

5.30

47

Medium temperature alloy

*SP 607

Sn-Ag3.5-Cu0.7

2170C

0

7.42

5.34

48

Medium temperature alloy

SP 608

Sn-Ag3.9-Cu0.6

2170C

0

7.42

5.34

48

Medium temperature alloy

SP 609

Sn-Ag3.8-Cu0.7

2170C

0

7.42

5.34

48

Medium temperature alloy

**SP610+

Sn-Ag3.0-Cu0.5-Ni0.06-Ge0.01

2190C

0

7.40

5.40

48

Medium temperature alloy

SP 614

Sn-Ag4.0-Cu0.5

2170C

0

7.42

5.34

48

Medium temperature alloy