| SHENMAO / PAI LEAD FREE SOLDER |
| |
Alloy No. |
Alloy Composition |
Melting
Pont
( C) |
Products
Bar |
Gravity |
Strength
( Kgf /mm) |
Elongation
(%) |
Remark |
SP 601 |
Sn-Ag2.5-Cu0.5 |
2200C |
0 |
7.40 |
5.30 |
57 |
Medium temperature alloy |
SP 603+ |
Sn-Ag3.5 |
2210C |
0 |
7.36 |
4.18 |
58 |
Soldering rework use |
SP 604+ |
Sn-Cu0.7 |
2270C |
0 |
7.32 |
3.80 |
50 |
Wave soldering & rework |
SP 605 |
Sn99.95 |
2320C |
0 |
7.28 |
2.20 |
55 |
Medium temperature alloy |
*SP 606+ |
Sn-Ag3.0-Cu0.5 |
2190C |
0 |
7.40 |
5.30 |
47 |
Medium temperature alloy |
*SP 607 |
Sn-Ag3.5-Cu0.7 |
2170C |
0 |
7.42 |
5.34 |
48 |
Medium temperature alloy |
SP 608 |
Sn-Ag3.9-Cu0.6 |
2170C |
0 |
7.42 |
5.34 |
48 |
Medium temperature alloy |
SP 609 |
Sn-Ag3.8-Cu0.7 |
2170C |
0 |
7.42 |
5.34 |
48 |
Medium temperature alloy |
**SP610+ |
Sn-Ag3.0-Cu0.5-Ni0.06-Ge0.01 |
2190C |
0 |
7.40 |
5.40 |
48 |
Medium temperature alloy |
SP 614 |
Sn-Ag4.0-Cu0.5 |
2170C |
0 |
7.42 |
5.34 |
48 |
Medium temperature alloy |
|
| |
SHENMAO / PAI LEAD FREE WIRE |
Product code |
SP601-R |
SP603+ |
SP604+ |
SP606+ |
SP607-R |
SP608-R |
SP609-R |
SP610+ |
SP614-R |
Alloy Composition |
Sn-Ag2.5-Cu0.5 |
Sn-Ag3.5 |
Sn-Cu0.7 |
Sn-Ag3.0-Cu0.5 |
Sn-Ag3.5-Cu0.7 |
Sn-Ag3.9-Cu0.6 |
Sn-Ag3.8-Cu0.7 |
Sn-Ag3.0-Cu0.5-Ni0.06-Ge0.01 |
Sn-Ag4.0-Cu0.5 |
Flux Type |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
ROL 1 |
Flux Content (wt %) |
2.0+0.5 |
2.0±0.5 |
2.0±0.5 |
2.0±0.5 |
2.0±0.5 |
2.0±0.5 |
2.0±0.5 |
2.0±0.5 |
2.0±0.5 |
Wire diameter (mm) |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
Up to 0.71 |
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